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Products and Services

We offer a wide range of PCB products including conventional PCBs, HDI PCBs, flexible PCBs, rigid-flex PCBs, backplane assemblies, and IC substrates. We also offer value-added services to support our customers' needs.

TTM services also include Electro-Mechanical Solutions (E-MS). Our products in this area include sheet metal design and fabrication, backplane assembly, system integration, test and logistics for a complete solution supporting sub-system and full system integration requirements.

Printed Circuit Board Fabrication

Conventional PCB

  • Multilayer up to 60+ layers
  • Embedded passives
  • Heavy copper up to 10 oz.
  • Over 50 UL approved laminates
  • Thickness up to 0.450"
  • Thin core dielectrics
  • Dimensions up to 30" x 54"
  • Mixed dielectrics

HDI

  • Up to 12L "anylayer" stacked uVia Structure
  • 1.6 / 2.0 mil line / space
  • Wide material and surface finish selections
  • 14 mil, 6L ultra thin structure
  • 3/7 mil uVia / Pad size
  • 0.4 mm pitch BGA with 2 traces fanout
  • Embedded, distributed and discrete passive components

Flex & Rigid-Flex

  • Type 2, 3 and 4 (double sided, multilayer and rigid-flex)
  • 30+ layers
  • Dimensions up to 24" x 48"
  • Acrylic, epoxy and adhesive-less polyimide flex materials
  • Over 50 rigid material options
  • Thickness up 0.300"
  • Bikini cut, bookbinder and loose leaf construction
  • Combination surface finishes
  • Epoxy fillet

RF & Microwave

  • High frequency / bandwidth designs
  • Planar and screened resistors
  • Dimensions up to 24" x 48"
  • Mixed dielectrics (hybrids)
  • Dielectric foam
  • Conductive paste
  • Plated cavities
  • Formed (conformal) PCBs
  • Optical machining

Thermal Management

  • Passive and active designs
  • Buried metal core constructions
  • Externally mounted heatsinks
  • Epoxy and B-stage films
  • Thermal & conductive bonding
  • Aluminum & copper base materials
  • Various surface finishes
  • In-house milling and bonding

IC Substrate

  • 2,4,6 Layers (2+2+2 stacked via)
  • BT material
  • Wire bonding (ENEPIG, Soft gold, Hard gold)
  • Type: SIP,CSP,BOC & FC package
  • Fine trace width/space 25/25um
  • Thin board: 130um(2L), 170um(4L)
  • Flip chip C4 pad

Custom Assembly

Backplanes

  • Dimensions up to 28" x 52"
  • Thickness up to 0.400"
  • Custom and Industry Standard
  • Press-fit (compliant –pin)
  • Surface mount (chip, QFP, BGA)
  • Wave / selective solder
  • AOI & X-ray inspection
  • Level 2, 3 & 4 testing
  • Conformal coating

Flex & Rigid-Flex

  • Dimensions up to 22" x 52"
  • Passive & active components
  • Press-fit (compliant-pin)
  • Surface mount (chip, QFP, BGA)
  • AOI & X-ray inspection
  • Level 2,3, & 4 testing

RF & Microwave

  • Dimensions up to 22" x 34"
  • Blind via, surface mount, thru-hole
  • 1-piece hermetic GPO and GPPO
  • X-ray inspection
  • RF testing (20+ GHz)

Integrated Assembly

  • Card cage through cabinet
  • Backplanes & Midplanes
  • Harnessing & cabling
  • Power supplies & fan trays
  • Peripherals & controllers
  • I/O interfaces
  • Functional testing
  • Mil & Aero conduction cooled