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Signal Integrity

In addition to our development work in optical electronics as well as high frequency RF products, we continue to extend digital copper signaling bandwidth up to and beyond 25 Gbps. We focus on key aspects at every phase, from concept through production. We enable this capability by selecting the correct circuit geometries, dielectric materials and process methodologies which impact signal integrity.

Validating the SI performance at the PCB level is completed using traditional TDR and when needed high frequency scopes to validate insertion loss for the most demanding applications.